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New solution of the partial differential equation of the grain groove profile problem in the case of evaporation/condensation

  • Tayssir Hamieh*
  • , Zoubir Khatir
  • , Ali Ibrahim
  • *Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

This paper constitutes a new contribution on the resolution of Mullins problem in the case of the evaporation-condensation and gives an exact and explicit solution of the second partial differential equation relative to the geometric profile of the grain boundary grooving. New analytical expressions of the solution, the groove profile, the derivative and the groove deep were obtained:y (x ,t )=-√{π C t }s i n θ [e r f c (x/2 √{C t } ) +∑n =1 ∞ (2/n )! (n!) 222 n√{3 n } s i n2 nθ (e r f c (x/√{3 n } 2 √{c t } ) ) ] y '(x ,t )=+sin/θ √{ex2/(2 c t )-s i n2θ } and ɛ0(θ )=√{π c t }sin θ [1 +∑n =1 ∞ (2/n )! (n!) 222 n√{3 n } s i n2 nθ ] It was proved that the found solution gave more accurate results relative to those obtained by Mullins that neglected the first derivative (|y'| ≪ 1) relative to 1. The results obtained by this new solution can be advantageously used to give more precise solution of the general problem when combining the two phenomena relative to the evaporation-condensation and the surface diffusion in thin polycrystalline films.
Original languageEnglish
Article number10143
Pages (from-to)10143
Number of pages17
JournalScientific Reports
Volume9
Issue number1
DOIs
Publication statusPublished - 12 Jul 2019
Externally publishedYes

Keywords

  • COPPER
  • DEGRADATION
  • DIFFUSION
  • GROWTH
  • LAYER
  • MECHANISMS
  • MODEL
  • STRESS
  • SURFACE
  • THIN-FILMS

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