A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices

M. Shqair*, Z. Khatir, A. Ibrahim, M. Berkani, A. Halouani, T. Hamieh

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

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Material Science

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Engineering